유형: Board Level, 패키지 냉각: TO-220, 부착 방법: Bolt On, 모양: Rectangular, Fins, 길이: 0.750" (19.05mm), 폭: 0.520" (13.21mm),
유형: Board Level, 패키지 냉각: TO-220, 부착 방법: Press Fit and PC Pin, 모양: Rectangular, Fins, 길이: 0.750" (19.05mm), 폭: 0.570" (14.47mm),
유형: Board Level, 패키지 냉각: TO-5, 부착 방법: Bolt On, 모양: Cylindrical, 길이: 0.400" (10.16mm), 폭: 0.370" (9.40mm),
유형: Board Level, Vertical, 패키지 냉각: TO-220, 부착 방법: Bolt On and PC Pin, 모양: Rectangular, Fins, 길이: 0.725" (18.42mm), 폭: 0.570" (14.47mm),
유형: Board Level, Vertical, 패키지 냉각: TO-220, 부착 방법: Bolt On and PC Pin, 모양: Rectangular, Fins, 길이: 1.180" (29.97mm), 폭: 1.000" (25.40mm),
유형: Board Level, 패키지 냉각: TO-220, 부착 방법: Bolt On, 모양: Rectangular, Fins, 길이: 0.600" (15.24mm), 폭: 0.570" (14.47mm),
유형: Top Mount, 패키지 냉각: D²Pak (TO-263), SOL-20, SOT-223, TO-220, 부착 방법: SMD Pad, 모양: Rectangular, Fins, 길이: 0.740" (18.80mm), 폭: 0.600" (15.24mm),
유형: Board Level, Vertical, 패키지 냉각: TO-220, 부착 방법: Bolt On and Board Mounts, 모양: Rectangular, Fins, 길이: 0.690" (17.53mm), 폭: 0.835" (21.21mm),
유형: Board Level, Vertical, 패키지 냉각: TO-220, 부착 방법: Bolt On and PC Pin, 모양: Rectangular, Fins, 길이: 0.600" (15.24mm), 폭: 0.570" (14.47mm),
패키지 냉각: BGA, 부착 방법: Clip, 모양: Cylindrical,
