유형: Board Level, 패키지 냉각: Stud Mounted Diode, 부착 방법: Bolt On, 모양: Rectangular, Fins, 길이: 6.000" (152.40mm), 폭: 5.000" (127.00mm),
유형: Board Level, Extrusion, 패키지 냉각: Stud Mounted Diode, 부착 방법: Press Fit, 모양: Rectangular, Fins, 길이: 5.000" (127.00mm), 폭: 4.000" (101.60mm),
유형: Board Level, Extrusion, 패키지 냉각: TO-3, DO-5, Stud Mount, 부착 방법: Press Fit, 모양: Rectangular, Fins, 길이: 5.421" (139.70mm), 폭: 4.750" (120.65mm),