유형: Top Mount, 패키지 냉각: BGA, 부착 방법: Thermal Tape, Adhesive (Included), 모양: Square, Pin Fins, 길이: 0.650" (16.51mm), 폭: 0.650" (16.51mm),
유형: Board Level, Vertical, 패키지 냉각: TO-247, TO-264, 부착 방법: Clip, Solder Foot, 모양: Rectangular, Fins, 길이: 0.984" (25.00mm), 폭: 0.710" (18.03mm),
유형: Top Mount, 패키지 냉각: BGA, 부착 방법: Clip, 모양: Square, Fins, 길이: 2.165" (55.00mm), 폭: 2.165" (55.00mm),
유형: Top Mount, 패키지 냉각: BGA, 부착 방법: Thermal Tape, Adhesive (Not Included), 모양: Square, Pin Fins, 길이: 0.850" (21.59mm), 폭: 0.850" (21.59mm),
유형: Board Level, 패키지 냉각: BGA, 부착 방법: Clip, 모양: Square, Angled Fins, 길이: 1.378" (35.00mm), 폭: 1.378" (35.00mm),
유형: Top Mount, 패키지 냉각: BGA, 부착 방법: Clip, 모양: Square, Fins, 길이: 1.870" (47.50mm), 폭: 1.870" (47.50mm),
유형: Top Mount, 패키지 냉각: BGA, 부착 방법: Clip, 모양: Square, Fins, 길이: 1.969" (50.00mm), 폭: 1.969" (50.00mm),
유형: Board Level, Vertical, 패키지 냉각: TO-220, 부착 방법: Clip, Solder Foot, 모양: Rectangular, Fins, 길이: 0.984" (25.00mm), 폭: 0.710" (18.03mm),
유형: Board Level, Vertical, 패키지 냉각: TO-220, 부착 방법: Clip, Solder Foot, 모양: Rectangular, Fins, 길이: 2.953" (75.00mm), 폭: 0.710" (18.03mm),
유형: Board Level, 패키지 냉각: BGA, 부착 방법: Clip, 모양: Square, Angled Fins, 길이: 1.673" (42.50mm), 폭: 1.673" (42.50mm),
유형: Board Level, Vertical, 패키지 냉각: TO-220, TO-247, 부착 방법: Solderable Feet, 모양: Rectangular, Fins, 길이: 0.803" (20.40mm), 폭: 1.339" (34.00mm),
유형: Board Level, 패키지 냉각: BGA, 부착 방법: Clip, 모양: Square, Angled Fins, 길이: 0.906" (23.00mm), 폭: 0.906" (23.00mm),
유형: Board Level, 패키지 냉각: BGA, 부착 방법: Clip, 모양: Square, Angled Fins, 길이: 1.339" (34.00mm), 폭: 1.339" (34.00mm),
유형: Board Level, Vertical, 패키지 냉각: TO-220, TO-247, TO-264, 부착 방법: Clip, Solder Foot, 모양: Rectangular, Fins, 길이: 1.181' (360.00mm), 폭: 1.063" (27.00mm),
유형: Board Level, Vertical, 패키지 냉각: TO-220, TO-247, TO-264, 부착 방법: Clip, Solder Foot, 모양: Rectangular, Fins, 길이: 0.984" (25.00mm), 폭: 1.339" (34.00mm),
유형: Top Mount, 패키지 냉각: BGA, 부착 방법: Thermal Tape, Adhesive (Not Included), 모양: Square, Pin Fins, 길이: 0.650" (16.51mm), 폭: 0.650" (16.51mm),
