유형: Top Mount, 패키지 냉각: BGA, 부착 방법: Thermal Tape, Adhesive (Not Included), 모양: Square, Pin Fins, 길이: 1.100" (27.94mm), 폭: 1.100" (27.94mm),
유형: Top Mount, 패키지 냉각: Assorted (BGA, LGA, CPU, ASIC...), 부착 방법: Thermal Tape, Adhesive (Not Included), 모양: Square, Pin Fins, 길이: 1.600" (40.64mm), 폭: 1.600" (40.64mm),
유형: Top Mount, 패키지 냉각: BGA, 부착 방법: Thermal Tape, Adhesive (Included), 모양: Square, Pin Fins, 길이: 0.827" (21.00mm), 폭: 0.827" (21.00mm),
유형: Top Mount, 패키지 냉각: Assorted (BGA, LGA, CPU, ASIC...), 부착 방법: Thermal Tape, Adhesive (Not Included), 모양: Square, Pin Fins, 길이: 1.750" (44.45mm), 폭: 1.700" (43.18mm),
유형: Board Level, Vertical, 패키지 냉각: TO-220, 부착 방법: Bolt On and PC Pin, 모양: Rectangular, Fins, 길이: 1.650" (41.91mm), 폭: 1.000" (25.40mm),
유형: Top Mount, 패키지 냉각: 14-DIP and 16-DIP, 부착 방법: Thermal Tape, Adhesive (Not Included), 모양: Rectangular, Fins, 길이: 0.750" (19.05mm), 폭: 0.415" (10.54mm),
유형: Top Mount, 패키지 냉각: BGA, 부착 방법: Thermal Tape, Adhesive (Included), 모양: Square, Pin Fins, 길이: 1.100" (27.94mm), 폭: 1.100" (27.94mm),
유형: Board Level, Vertical, 패키지 냉각: TO-218, TO-220, TO-247, 부착 방법: Bolt On and PC Pin, 모양: Rectangular, Fins, 길이: 1.000" (25.40mm), 폭: 1.650" (41.91mm),
유형: Board Level, Vertical, 패키지 냉각: TO-220, TO-218, 부착 방법: Bolt On and PC Pin, 모양: Rectangular, Fins, 길이: 1.000" (25.40mm), 폭: 0.640" (16.26mm),
