유형: Top Mount, 패키지 냉각: BGA, 부착 방법: Clip, 모양: Square, Pin Fins, 길이: 1.063" (27.00mm), 폭: 1.063" (27.00mm),
유형: Top Mount, 패키지 냉각: BGA, 부착 방법: Clip, 모양: Square, Pin Fins, 길이: 1.378" (35.00mm), 폭: 1.378" (35.00mm),
유형: Top Mount, 패키지 냉각: BGA, 부착 방법: Clip, 모양: Square, Fins, 길이: 1.378" (35.00mm), 폭: 1.378" (35.00mm),
유형: Top Mount, 패키지 냉각: BGA, 부착 방법: Clip, 모양: Square, Pin Fins, 길이: 1.575" (40.00mm), 폭: 1.575" (40.00mm),
유형: Top Mount, 패키지 냉각: BGA, 부착 방법: Clip, 모양: Square, Pin Fins, 길이: 0.827" (21.00mm), 폭: 0.827" (21.00mm),
유형: Top Mount, 패키지 냉각: BGA, 부착 방법: Thermal Tape, Adhesive (Included), 모양: Square, Pin Fins, 길이: 0.850" (21.59mm), 폭: 0.850" (21.59mm),
유형: Board Level, 패키지 냉각: Assorted (BGA, LGA, CPU, ASIC...), 부착 방법: Thermal Tape, Adhesive (Included), 모양: Square, Fins, 길이: 0.650" (16.51mm), 폭: 0.653" (16.59mm),
유형: Top Mount, 패키지 냉각: BGA, 부착 방법: Clip, 모양: Square, Fins, 길이: 2.165" (55.00mm), 폭: 2.165" (55.00mm),
유형: Top Mount, 패키지 냉각: TO-247, TO-264, 부착 방법: Clip, 모양: Rectangular, Fins, 길이: 1.060" (26.92mm), 폭: 1.740" (44.20mm),
유형: Top Mount, 패키지 냉각: BGA, 부착 방법: Clip, 모양: Square, Fins, 길이: 1.969" (50.00mm), 폭: 1.969" (50.00mm),
유형: Board Level, 패키지 냉각: BGA, 부착 방법: Clip, 모양: Square, Angled Fins, 길이: 1.142" (29.00mm), 폭: 1.142" (29.00mm),
유형: Board Level, 패키지 냉각: BGA, 부착 방법: Clip, 모양: Square, Angled Fins, 길이: 1.024" (26.00mm), 폭: 1.024" (26.00mm),
유형: Top Mount, 패키지 냉각: BGA, 부착 방법: Clip, 모양: Square, Fins, 길이: 1.870" (47.50mm), 폭: 1.870" (47.50mm),
유형: Board Level, Vertical, 패키지 냉각: TO-220, TO-247, TO-264, 부착 방법: Clip, Solder Foot, 모양: Rectangular, Fins, 길이: 0.984" (25.00mm), 폭: 1.063" (27.00mm),
유형: Board Level, Vertical, 패키지 냉각: TO-220, TO-247, TO-264, 부착 방법: Clip, Solder Foot, 모양: Rectangular, Fins, 길이: 2.953" (75.00mm), 폭: 1.181" (30.00mm),
유형: Board Level, Vertical, 패키지 냉각: TO-220, 부착 방법: Clip, Solder Foot, 모양: Rectangular, Fins, 길이: 1.969" (50.00mm), 폭: 0.710" (18.03mm),
유형: Board Level, Vertical, 패키지 냉각: TO-220, TO-247, TO-264, 부착 방법: Clip, Solder Foot, 모양: Rectangular, Fins, 길이: 1.969" (50.00mm), 폭: 1.181" (30.00mm),
유형: Board Level, 패키지 냉각: BGA, 부착 방법: Clip, 모양: Square, Angled Fins, 길이: 1.441" (36.60mm), 폭: 1.441" (36.60mm),
유형: Board Level, Vertical, 패키지 냉각: TO-247, TO-264, 부착 방법: Clip, Solder Foot, 모양: Rectangular, Fins, 길이: 2.953" (75.00mm), 폭: 0.710" (18.03mm),
유형: Board Level, Vertical, 패키지 냉각: TO-247, TO-264, 부착 방법: Clip, Solder Foot, 모양: Rectangular, Fins, 길이: 1.969" (50.00mm), 폭: 0.710" (18.03mm),
유형: Board Level, 패키지 냉각: BGA, 부착 방법: Clip, 모양: Square, Angled Fins, 길이: 1.378" (35.00mm), 폭: 1.378" (35.00mm),
유형: Board Level, Vertical, 패키지 냉각: TO-220, TO-247, TO-264, 부착 방법: Clip, Solder Foot, 모양: Rectangular, Fins, 길이: 2.953" (75.00mm), 폭: 1.063" (27.00mm),
유형: Board Level, Vertical, 패키지 냉각: TO-220, TO-247, TO-264, 부착 방법: Clip, Solder Foot, 모양: Rectangular, Fins, 길이: 0.984" (25.00mm), 폭: 1.181" (30.00mm),
유형: Board Level, 패키지 냉각: BGA, 부착 방법: Clip, 모양: Square, Angled Fins, 길이: 1.575" (40.00mm), 폭: 1.575" (40.00mm),
유형: Board Level, Vertical, 패키지 냉각: TO-247, TO-264, 부착 방법: Clip, Solder Foot, 모양: Rectangular, Fins, 길이: 2.953" (75.00mm), 폭: 1.614" (41.00mm),
