유형: Top Mount, 패키지 냉각: 40-DIP, 부착 방법: Thermal Tape, Adhesive (Not Included), 모양: Rectangular, Fins, 길이: 2.000" (50.80mm), 폭: 0.530" (13.46mm),
유형: Board Level, Vertical, 패키지 냉각: TO-220, 부착 방법: Clip and PC Pin, 모양: Rectangular, Fins, 길이: 1.375" (34.93mm), 폭: 0.860" (21.84mm),
유형: Board Level, Vertical, 패키지 냉각: TO-218, 부착 방법: Bolt On and PC Pin, 모양: Rectangular, Fins, 길이: 1.500" (38.10mm), 폭: 1.650" (41.91mm),
유형: Board Level, 패키지 냉각: TO-220, TO-262, 부착 방법: Clip, 모양: Rectangular, Fins, 길이: 0.850" (21.59mm), 폭: 1.000" (25.40mm),
유형: Board Level, 패키지 냉각: TO-220 (Dual), 부착 방법: Bolt On, 모양: Rectangular, Fins, 길이: 1.780" (45.21mm), 폭: 1.780" (45.21mm),
유형: Board Level, 패키지 냉각: TO-3, 부착 방법: Bolt On, 모양: Square, Pin Fins, 길이: 1.810" (45.97mm), 폭: 1.810" (45.97mm),
유형: Board Level, Vertical, 패키지 냉각: TO-218, TO-247, 부착 방법: Bolt On and PC Pin, 모양: Rectangular, Fins, 길이: 1.000" (25.40mm), 폭: 1.375" (34.93mm),
유형: Board Level, 패키지 냉각: TO-3, 부착 방법: Bolt On, 모양: Rhombus, 길이: 1.550" (39.37mm), 폭: 1.550" (39.37mm),
유형: Board Level, 패키지 냉각: TO-202, 부착 방법: Clip, 모양: Rectangular, 길이: 0.900" (22.86mm), 폭: 1.020" (25.91mm),
유형: Top Mount, 패키지 냉각: 28-DIP, 부착 방법: Thermal Tape, Adhesive (Not Included), 모양: Rectangular, Fins, 길이: 1.450" (36.83mm), 폭: 0.530" (13.46mm),
유형: Board Level, 패키지 냉각: TO-218, 부착 방법: Bolt On, 모양: Rectangular, Fins, 길이: 2.000" (50.80mm), 폭: 1.650" (41.91mm),
유형: Board Level, Vertical, 패키지 냉각: TO-218, 부착 방법: Bolt On and PC Pin, 모양: Rectangular, Fins, 길이: 1.000" (25.40mm), 폭: 1.650" (41.91mm),
유형: Board Level, Vertical, 패키지 냉각: TO-220, 부착 방법: Bolt On and PC Pin, 모양: Rectangular, Fins, 길이: 1.500" (38.10mm), 폭: 1.374" (34.90mm),
유형: Top Mount, 패키지 냉각: 14-DIP and 16-DIP, 부착 방법: Press Fit, Slide On, 모양: Rectangular, Fins, 길이: 0.890" (22.61mm), 폭: 0.600" (15.24mm),
유형: Board Level, Vertical, 패키지 냉각: TO-218, TO-247, 부착 방법: Bolt On and PC Pin, 모양: Rectangular, Fins, 길이: 1.840" (46.74mm), 폭: 0.490" (12.44mm),
유형: Board Level, 패키지 냉각: Half Brick DC/DC Converter, 부착 방법: Bolt On, Thermal Material, 모양: Rectangular, Fins, 길이: 2.280" (57.90mm), 폭: 2.401" (61.00mm),
유형: Board Level, 패키지 냉각: Half Brick DC/DC Converter, 부착 방법: Bolt On, Thermal Material, 모양: Rectangular, Fins, 길이: 2.402" (61.00mm), 폭: 2.280" (57.91mm),
유형: Top Mount, 패키지 냉각: Power Modules, 부착 방법: Adhesive, 모양: Rectangular, Fins, 길이: 3.000" (76.20mm), 폭: 5.210" (132.33mm),
유형: Top Mount, 패키지 냉각: Power Modules, 부착 방법: Adhesive, 모양: Rectangular, Fins, 길이: 3.000" (76.20mm), 폭: 7.200" (182.88mm),
유형: Top Mount, Extrusion, 패키지 냉각: Power Modules, 부착 방법: Adhesive, 모양: Rectangular, Fins, 길이: 12.000" (304.80mm), 폭: 7.380" (187.45mm),
패키지 냉각: BGA, 부착 방법: Clip, 모양: Cylindrical,