유형: Board Level, Vertical, 패키지 냉각: SOT-32, TO-220, TOP-3, 부착 방법: Bolt On and PC Pin, 모양: Rectangular, Fins, 길이: 0.984" (25.00mm), 폭: 1.359" (34.50mm),
유형: Top Mount, 패키지 냉각: TO-252 (DPak), 부착 방법: SMD Pad, 모양: Rectangular, Fins, 길이: 0.320" (8.13mm), 폭: 0.790" (20.07mm),
유형: Top Mount, 부착 방법: Press Fit, 모양: Cylindrical,
유형: Board Level, 패키지 냉각: TO-220, 부착 방법: Bolt On, 모양: Rectangular, Fins, 길이: 0.984" (25.00mm), 폭: 0.472" (12.00mm),
유형: Top Mount, 패키지 냉각: Assorted (BGA, LGA, CPU, ASIC...), 부착 방법: Thermal Tape, Adhesive (Not Included), 모양: Square, Fins, 길이: 1.181" (30.00mm), 폭: 1.181" (30.00mm),
유형: Top Mount, 패키지 냉각: 18-DIP, 부착 방법: Press Fit, 모양: Rectangular, Fins, 길이: 0.900" (23.00mm), 폭: 0.250" (6.35mm),
유형: Top Mount, 패키지 냉각: Assorted (BGA, LGA, CPU, ASIC...), 부착 방법: Thermal Tape, Adhesive (Not Included), 모양: Square, Pin Fins, 길이: 0.551" (14.00mm), 폭: 0.551" (14.00mm),
유형: Board Level, Vertical, 패키지 냉각: TO-220, 부착 방법: Press Fit and PC Pin, 모양: Rectangular, Fins, 길이: 0.748" (19.00mm), 폭: 0.504" (12.80mm),
유형: Board Level, Vertical, 패키지 냉각: TO-220, 부착 방법: Bolt On and PC Pin, 모양: Rectangular, Fins, 길이: 0.750" (19.05mm), 폭: 0.520" (13.21mm),
유형: Top Mount, 패키지 냉각: 6-Dip and 8-Dip, 부착 방법: Press Fit, 모양: Rectangular, Fins, 길이: 0.334" (8.50mm), 폭: 0.250" (6.35mm),
유형: Top Mount, 패키지 냉각: Assorted (BGA, LGA, CPU, ASIC...), 모양: Square, Pin Fins, 길이: 0.394" (10.00mm), 폭: 0.394" (10.00mm),
유형: Board Level, 패키지 냉각: TO-220, 부착 방법: Press Fit, 모양: Rectangular, Fins, 길이: 0.748" (19.00mm), 폭: 0.504" (12.80mm),
유형: Top Mount, 패키지 냉각: Assorted (BGA, LGA, CPU, ASIC...), 부착 방법: Thermal Tape, Adhesive (Not Included), 모양: Rectangular, Fins, 길이: 1.378" (35.00mm), 폭: 0.866" (22.00mm),
유형: Top Mount, 패키지 냉각: Assorted (BGA, LGA, CPU, ASIC...), 부착 방법: Thermal Tape, Adhesive (Not Included), 모양: Square, Fins, 길이: 0.669" (17.00mm), 폭: 0.669" (17.00mm),
유형: Board Level, 패키지 냉각: TO-220, 부착 방법: Press Fit, 모양: Rectangular, Fins, 길이: 0.591" (15.00mm), 폭: 0.504" (12.80mm),
유형: Board Level, 패키지 냉각: TO-220, 부착 방법: Bolt On, 모양: Rectangular, Fins, 길이: 1.378" (35.00mm), 폭: 0.728" (18.50mm),
유형: Top Mount, 패키지 냉각: Assorted (BGA, LGA, CPU, ASIC...), 부착 방법: Bolt On, 모양: Square, Pin Fins, 길이: 0.984" (25.00mm), 폭: 0.984" (25.00mm),
