유형: Board Level, 패키지 냉각: TO-220, 부착 방법: Bolt On, 모양: Rectangular, Fins, 길이: 1.450" (36.83mm), 폭: 0.700" (17.78mm),
유형: Top Mount, 패키지 냉각: Assorted (BGA, LGA, CPU, ASIC...), 부착 방법: Bolt On and PC Pin, 모양: Square, Fins, 길이: 1.575" (40.00mm), 폭: 1.575" (40.00mm),
유형: Board Level, Vertical, 패키지 냉각: TO-220, 부착 방법: Bolt On and Board Mounts, 모양: Rectangular, Fins, 길이: 1.340" (34.04mm), 폭: 1.000" (25.40mm),
유형: Top Mount, 패키지 냉각: Assorted (BGA, LGA, CPU, ASIC...), 부착 방법: Thermal Tape, Adhesive (Not Included), 모양: Square, Pin Fins, 길이: 0.335" (8.50mm), 폭: 0.335" (8.50mm),
유형: Top Mount, 패키지 냉각: Assorted (BGA, LGA, CPU, ASIC...), 부착 방법: Thermal Tape, Adhesive (Not Included), 모양: Square, Pin Fins, 길이: 0.472" (12.00mm), 폭: 0.472" (12.00mm),
유형: Top Mount, 패키지 냉각: Assorted (BGA, LGA, CPU, ASIC...), 부착 방법: Press Fit, 모양: Square, Pin Fins, 길이: 0.984" (25.00mm), 폭: 0.984" (25.00mm),
유형: Board Level, Vertical, 패키지 냉각: SOT-32, TO-220, TOP-3, 부착 방법: Bolt On and PC Pin, 모양: Rectangular, Fins, 길이: 1.500" (38.10mm), 폭: 1.772" (45.00mm),
유형: Top Mount, 패키지 냉각: Assorted (BGA, LGA, CPU, ASIC...), 부착 방법: Thermal Tape, Adhesive (Not Included), 모양: Square, Pin Fins, 길이: 1.209" (30.70mm), 폭: 1.209" (30.70mm),
유형: Top Mount, 패키지 냉각: Assorted (BGA, LGA, CPU, ASIC...), 부착 방법: Thermal Tape, Adhesive (Included), 모양: Square, Fins, 길이: 1.457" (37.00mm), 폭: 1.457" (37.00mm),
유형: Top Mount, 패키지 냉각: Assorted (BGA, LGA, CPU, ASIC...), 부착 방법: Bolt On and PC Pin, 모양: Square, Pin Fins, 길이: 1.500" (38.10mm), 폭: 1.374" (34.90mm),
유형: Board Level, 패키지 냉각: TO-220, 부착 방법: Bolt On, 모양: Rectangular, Fins, 길이: 0.984" (25.00mm), 폭: 0.550" (13.97mm),
유형: Board Level, Vertical, 패키지 냉각: SOT-32, 부착 방법: Bolt On and PC Pin, 모양: Rectangular, Fins, 길이: 0.591" (15.00mm), 폭: 0.472" (12.00mm),
유형: Top Mount, 부착 방법: Press Fit, 모양: Cylindrical,
유형: Board Level, 패키지 냉각: TO-220, 부착 방법: Bolt On, 모양: Rectangular, Fins, 길이: 0.712" (18.08mm), 폭: 1.000" (25.40mm),
유형: Board Level, 패키지 냉각: TO-220, 부착 방법: Bolt On, 모양: Rectangular, Fins, 길이: 0.984" (25.00mm), 폭: 0.472" (12.00mm),
유형: Top Mount, 패키지 냉각: Assorted (BGA, LGA, CPU, ASIC...), 부착 방법: Thermal Tape, Adhesive (Not Included), 모양: Square, Pin Fins, 길이: 0.984" (25.00mm), 폭: 0.984" (25.00mm),
유형: Board Level, 패키지 냉각: TO-220, 부착 방법: Bolt On, 모양: Rectangular, Fins, 길이: 1.180" (29.97mm), 폭: 1.000" (25.40mm),
유형: Board Level, 패키지 냉각: TO-220, 부착 방법: Bolt On, 모양: Rectangular, Fins, 길이: 0.700" (17.78mm), 폭: 1.750" (44.45mm),
유형: Board Level, 패키지 냉각: TO-220, 부착 방법: Bolt On and PC Pin, 모양: Rectangular, Fins, 길이: 0.984" (25.00mm), 폭: 1.181" (30.00mm),
유형: Top Mount, 패키지 냉각: Assorted (BGA, LGA, CPU, ASIC...), 부착 방법: Thermal Tape, Adhesive (Not Included), 모양: Square, Fins, 길이: 1.575" (40.00mm), 폭: 1.575" (40.00mm),
유형: Top Mount, 패키지 냉각: TO-263 (D²Pak), 부착 방법: SMD Pad, 모양: Rectangular, Fins, 길이: 0.500" (12.70mm), 폭: 1.031" (26.20mm),
유형: Top Mount, 패키지 냉각: TO-220, 부착 방법: Bolt On, 모양: Rectangular, Fins, 길이: 0.787" (20.00mm), 폭: 1.142" (29.00mm),
유형: Board Level, 패키지 냉각: TO-220, 부착 방법: Bolt On, 모양: Rectangular, Fins, 길이: 0.750" (19.05mm), 폭: 0.520" (13.21mm),
유형: Board Level, 패키지 냉각: TO-220, 부착 방법: Bolt On, 모양: Rectangular, Fins, 길이: 1.181" (30.00mm), 폭: 1.260" (32.00mm),
유형: Top Mount, 패키지 냉각: 14-DIP and 16-DIP, 부착 방법: Press Fit, 모양: Rectangular, Fins, 길이: 0.250" (6.35mm), 폭: 0.748" (19.00mm),
유형: Board Level, Vertical, 패키지 냉각: TO-126, 부착 방법: Press Fit, Slide On, 모양: Rectangular, Fins, 길이: 0.520" (13.21mm), 폭: 0.775" (19.68mm),
유형: Top Mount, 패키지 냉각: Assorted (BGA, LGA, CPU, ASIC...), 부착 방법: Thermal Tape, Adhesive (Not Included), 모양: Square, Fins, 길이: 1.457" (37.00mm), 폭: 1.457" (37.00mm),
유형: Top Mount, 패키지 냉각: Assorted (BGA, LGA, CPU, ASIC...), 부착 방법: Bolt On and PC Pin, 모양: Square, Fins, 길이: 1.181" (30.00mm), 폭: 1.181" (30.00mm),
유형: Board Level, 패키지 냉각: TO-220, 부착 방법: Bolt On and PC Pin, 모양: Rectangular, Fins, 길이: 1.969" (50.00mm), 폭: 1.181" (30.00mm),
