유형: Top Mount, 패키지 냉각: Assorted (BGA, LGA, CPU, ASIC...), 부착 방법: Clip, Thermal Material, 모양: Rectangular, Pin Fins, 길이: 2.895" (73.53mm), 폭: 2.000" (50.80mm),
유형: Top Mount, 패키지 냉각: BGA, 부착 방법: Thermal Tape, Adhesive (Not Included), 모양: Square, Pin Fins, 길이: 1.378" (35.00mm), 폭: 1.378" (35.00mm),
