유형: Heat Spreader, 모양: Square, Fins, 길이: 1.693" (43.00mm), 폭: 1.693" (43.00mm),
유형: Heat Spreader, 패키지 냉각: Assorted (BGA, LGA, CPU, ASIC...), 부착 방법: Adhesive, 모양: Rectangular, 길이: 2.000" (50.80mm), 폭: 0.500" (12.70mm),
유형: Heat Spreader, 모양: Square, Fins, 길이: 0.472" (12.00mm), 폭: 0.472" (12.00mm),
유형: Heat Spreader, 패키지 냉각: Assorted (BGA, LGA, CPU, ASIC...), 부착 방법: Adhesive, 모양: Rectangular, 길이: 3.000" (76.20mm), 폭: 0.750" (19.05mm),
유형: Heat Spreader, 부착 방법: Thermal Tape, Adhesive (Included), 모양: Square, Fins, 길이: 0.787" (20.00mm), 폭: 0.787" (20.00mm),
유형: Heat Spreader, 패키지 냉각: Assorted (BGA, LGA, CPU, ASIC...), 부착 방법: Adhesive, 모양: Square, 길이: 3.937" (100.00mm), 폭: 3.937" (100.00mm),
유형: Heat Spreader, 패키지 냉각: Assorted (BGA, LGA, CPU, ASIC...), 모양: Square, 길이: 1.575" (40.00mm), 폭: 1.575" (40.00mm),
유형: Heat Spreader, 패키지 냉각: Assorted (BGA, LGA, CPU, ASIC...), 모양: Square, 길이: 0.787" (20.00mm), 폭: 0.787" (20.00mm),
유형: Heat Spreader, 패키지 냉각: Assorted (BGA, LGA, CPU, ASIC...), 모양: Square, 길이: 0.394" (10.00mm), 폭: 0.394" (10.00mm),
유형: Heat Spreader, 부착 방법: Thermal Tape, Adhesive (Included), 모양: Square, Fins, 길이: 0.472" (12.00mm), 폭: 0.472" (12.00mm),
