유형: Heat Spreader, 패키지 냉각: Assorted (BGA, LGA, CPU, ASIC...), 부착 방법: Adhesive, 모양: Rectangular, 길이: 3.000" (76.20mm), 폭: 1.000" (25.40mm),
유형: Heat Spreader, 패키지 냉각: Assorted (BGA, LGA, CPU, ASIC...), 부착 방법: Adhesive, 모양: Square, 길이: 11.811" (300.00mm), 폭: 11.811" (300.00mm),
유형: Heat Spreader, 패키지 냉각: Assorted (BGA, LGA, CPU, ASIC...), 부착 방법: Thermal Tape, Adhesive (Included), 모양: Square, 길이: 0.394" (10.00mm), 폭: 0.394" (10.00mm),
유형: Heat Spreader, 패키지 냉각: Assorted (BGA, LGA, CPU, ASIC...), 모양: Square, 길이: 1.181" (30.00mm), 폭: 1.181" (30.00mm),
유형: Heat Spreader, 패키지 냉각: Assorted (BGA, LGA, CPU, ASIC...), 부착 방법: Adhesive, 모양: Rectangular, 길이: 3.000" (76.20mm), 폭: 0.750" (19.05mm),
유형: Heat Spreader, 패키지 냉각: Assorted (BGA, LGA, CPU, ASIC...), 부착 방법: Adhesive, 모양: Rectangular, 길이: 2.000" (50.80mm), 폭: 0.500" (12.70mm),
유형: Heat Spreader, 부착 방법: Thermal Tape, Adhesive (Included), 모양: Square, Fins, 길이: 2.362" (60.00mm), 폭: 2.362" (60.00mm),
유형: Heat Spreader, 패키지 냉각: Assorted (BGA, LGA, CPU, ASIC...), 부착 방법: Adhesive, 모양: Rectangular, 길이: 3.000" (76.20mm), 폭: 0.500" (12.70mm),
유형: Heat Spreader, 패키지 냉각: Assorted (BGA, LGA, CPU, ASIC...), 부착 방법: Adhesive, 모양: Rectangular, Fins, 길이: 8.740" (222.00mm), 폭: 6.496" (165.00mm),
유형: Heat Spreader, 모양: Square, Fins, 길이: 2.362" (60.00mm), 폭: 2.362" (60.00mm),
유형: Heat Spreader, 패키지 냉각: Assorted (BGA, LGA, CPU, ASIC...), 부착 방법: Adhesive, 모양: Rectangular, 길이: 4.000" (101.60mm), 폭: 1.000" (25.40mm),
유형: Heat Spreader, 패키지 냉각: Assorted (BGA, LGA, CPU, ASIC...), 부착 방법: Adhesive, 모양: Rectangular, 길이: 4.000" (101.60mm), 폭: 1.500" (38.10mm),
유형: Heat Spreader, 부착 방법: Thermal Tape, Adhesive (Included), 모양: Square, Fins, 길이: 1.201" (30.50mm), 폭: 1.201" (30.50mm),
유형: Heat Spreader, 모양: Square, Fins, 길이: 0.787" (20.00mm), 폭: 0.787" (20.00mm),
유형: Heat Spreader, 패키지 냉각: Assorted (BGA, LGA, CPU, ASIC...), 부착 방법: Adhesive, 모양: Square, 길이: 3.937" (100.00mm), 폭: 3.937" (100.00mm),
유형: Heat Spreader, 패키지 냉각: Assorted (BGA, LGA, CPU, ASIC...), 부착 방법: Adhesive, 모양: Square, 길이: 5.906" (150.00mm), 폭: 5.910" (150.00mm),
유형: Heat Spreader, 패키지 냉각: Assorted (BGA, LGA, CPU, ASIC...), 부착 방법: Thermal Tape, Adhesive (Included), 모양: Square, 길이: 0.787" (20.00mm), 폭: 0.787" (20.00mm),
유형: Heat Spreader, 모양: Square, Fins, 길이: 1.201" (30.50mm), 폭: 1.201" (30.50mm),
유형: Heat Spreader, 부착 방법: Thermal Tape, Adhesive (Included), 모양: Square, Fins, 길이: 1.260" (32.00mm), 폭: 1.260" (32.00mm),
유형: Top Mount, 부착 방법: Thermal Tape, Adhesive (Included), 모양: Square, Pin Fins, 길이: 0.472" (12.00mm), 폭: 0.472" (12.00mm),
유형: Heat Spreader, 모양: Square, Fins, 길이: 1.260" (32.00mm), 폭: 1.260" (32.00mm),
유형: Heat Spreader, 부착 방법: Thermal Tape, Adhesive (Included), 모양: Square, Fins, 길이: 1.693" (43.00mm), 폭: 1.693" (43.00mm),
유형: Heat Spreader, 패키지 냉각: Assorted (BGA, LGA, CPU, ASIC...), 부착 방법: Thermal Tape, Adhesive (Included), 모양: Square, 길이: 1.181" (30.00mm), 폭: 1.181" (30.00mm),