유형: Board Level, Vertical, 패키지 냉각: TO-220, TO-218, 부착 방법: Bolt On, 모양: Rectangular, Fins, 길이: 1.500" (38.10mm), 폭: 0.640" (16.26mm),
유형: Top Mount, 패키지 냉각: Assorted (BGA, LGA, CPU, ASIC...), 부착 방법: Thermal Tape, Adhesive (Included), 모양: Square, Pin Fins, 길이: 1.750" (44.45mm), 폭: 1.700" (43.18mm),
유형: Top Mount, 패키지 냉각: BGA, 부착 방법: Adhesive, 모양: Square, Pin Fins, 길이: 0.984" (25.00mm), 폭: 0.984" (25.00mm),
유형: Top Mount, 패키지 냉각: BGA, 부착 방법: Thermal Tape, Adhesive (Included), 모양: Square, Fins, 길이: 1.378" (35.00mm), 폭: 1.378" (35.00mm),
유형: Top Mount, 패키지 냉각: BGA, 부착 방법: Thermal Tape, Adhesive (Not Included), 모양: Square, Pin Fins, 길이: 1.378" (35.00mm), 폭: 1.378" (35.00mm),
